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Books (Texts and Proceedings)
Chapters
Research Papers (Selected)
Graduate Student |
1995- 1999
(Selected)
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"Application of Nonassociative Hierarchical Model
for Geologic Materials for Active Earth Pressure Experiment," Short Comm.,
Int. J. Num. Analyt. Methods in Geomech., Vol. 19, No. 8, 1995, pp.
573-580. (Ugai, K. and Desai, C.S.)
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"Constitutive Modeling and Analysis of Creeping
Slopes," J. of Geotech.
Eng., ASCE, Vol. 121, No.
1, 1995, pp. 43-56. (Desai, C.S., Samtani, N.C. and Vulliet, L.)
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"Modelling and Testing of Cohesive Soil Using
Disturbed
State Concept," J. of Eng. Mech., ASCE, Vol. 121, No. 5, 1995, pp. 648-658.
(Katti, D.R. and Desai, C.S.)
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"Mechanical and Ultrasonic Anisotropic Response
of Soil," J. of Eng.
Mech., ASCE, Vol. 121, No. 6, 1995, pp. 744-752. (Desai, C.S., Jagannath,
S.V. and Kundu, T.)
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"Disturbed
State Constitutive Modelling Based on Stress-Strain and Nondestructive
Behavior," Int. J. Solids and Structures, Vol. 33, No. 11, Feb. 1996.
(Desai, C.S., and Toth, J.)
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"An Interface Model to Describe Viscoplastic
Behavior," Int. J. Num. Analyt. Meth. Geomech., Vol. 20, No. 4, April. 1996,
pp. 231-252. (Samtani,
N.C., Desai, C.S. and Vulliet, L.)
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"Numerical Algorithms and Mesh Dependence in the
Disturbed
State Concept," Int. J. Num. Methods in
Eng.,
Vol. 40, June 1997. (Desai, C.S., Basaran, C. and Zhang, W.)
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"Thermomechanical Response of Materials and
Interfaces in Electronic Packaging: Part I and II: Unified Constitutive
Model and Calibration," J. of Elect. Packaging, ASME, 119(4), 294-300.
(Desai, C.S., Chia, J., Kundu, T. and Prince, J.), December 1997.
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"Thermomechanical Finite Element Analysis of
Problems in Electronic Packaging Using the
Disturbed State Concept:
Part Iand II: Theory and Formulation," J. of Elect. Packaging, ASME, 120(1),
41-47, 1998. (Basaran, C., Desai, C.S. and Kundu, T.)
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"Cyclic Interface and Joint Shear Device
Including Pore Pressure Effects," J. of Geotech.
Eng., ASCE, Vol. 123, No.
6, 1997. (Desai, C.S. and Rigby, D.B.)
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"Disturbed
State Concept for Constitutive Modelling of Partially Saturated Porous
Materials," Proc. 6th Int. Symp. on Numerical Models in Geomech., Montreal,
Canada, July 1997. (Geiser, F., Laloui, L., Vulliet, L., and Desai, C.S.)
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"Computational Aspects of
Disturbed State
Constitutive Models," Int. J. of Computer Methods in Appl. Mech. and Eng.,
151, 361-376, 1998. (Desai, C.S. and Zhang, W.)
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"Thermomechanical Analysis in Electronic
Packaging with Unified Constitutive Model for Materials and Joints,"
Components, Packaging and Manuf. Tech., Part B: Advanced Packaging, IEEE
Trans., 21(1), 87-97, 1998. (Desai, C.S., Basaran, C, Dishongh, T. and
Prince, J.)
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"Disturbed
State Constitutive Model for Thermomechanical Behavior of Dislocated Silicon
with Impurities," J. of Applied Physics, Vol. 84, No. 11, 1998, pp.
5977-5984. (Desai, C.S., Dishongh, T. and Deneke, P.)
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"Nonlinear Analysis of 3-D Seismic Interaction of
Soil-Pile Structure Systems and Applications," J. of
Eng. Structures, Vol. 22,
No. 2, 2000. (Cai, Y.X., Gould, P.L. and Desai, C.S.)
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"Fundamental Yet Simplified Model for
Liquefaction Instability," Int. J. Num. & Analyt. Meth. in Geomech., Vol.
22, 1998, pp. 721-748. (Desai, C.S., Park, I.J. and Shao, C.)
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"Stability Analysis for Consolidation and Dynamic
Response of Mine Tailing Dam," Prof., Conf. on Tailings & Mine Waste '97,
Colorado State Univ., Fort Collins, CO, January 1998. (Desai, C.S., Shao,
C., White, D. and
Davis,
S.)
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“Review and Evaluation of Approaches for
Thermomechanical Analysis for Stress,Failure and Reliability,” Invited
Paper, Proc., INTERPACK 99, ASME,
Hawaii, June1999.
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Structural Reliability of PBGA Solder Joints with
the Disturbed
State Concept,” Proc., INTERPACK 99, ASME,
Hawaii,
June 1999. (Zwick, J.W., and Desai, C.S.)
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“A Unified Model Based on
Disturbed State Concept and
Multi Domain Method for Design and Reliability in Electronic Packaging,”
Proc., INTERPACK 99, ASME,
Hawaii,
June 1999. (Rassaiain, M., Desai, C.S., and Lee. J.T.)
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“Stability of Earth Dam Contaminated by Chemical
Transport,” Int. J. Num. Analyt. Meth. Geomech., Vol. 23, No. 15, 1999, pp.
1893-1908. (Ahn, T., and Desai, C.S.)
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