The DSC and its specialized versions (e.g. HISS model) have been implemented in nonlinear finite element procedures for static, dynamic and time dependent (creep) analysis of a wide range of problems:
3) Thermoviscoplastic analysis in electronic packaging: chip-substrate, BGA, PEM, etc. including cyclic fatigue failure and reliability
The DSC is a fundamental approach based on the consideration of interacting mechanisms of components (relative intact and fully adjusted parts) in a deforming material element due to internal self-adjustment of its microstructure. It provides a hierarchical framework which includes most of the previously available models such as elastic, plastic, thermoviscoplastic, damage and softening, as special cases. It provides robust and consistent computations for localization, instability in the microstructure, and avoids spurious or pathological mesh dependence. It provides implicity for microcrack interaction, characteristic dimension, and nonlocal aspects, without such external enrichment as microcrack kinematics, Cosserat and gradient theories.